Stealth dicing, laser ablation, Daf tape, - dicing-grinding service
www.dicing-grinding.com/services/laser/
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sublimes.
Laser grooving technique offers benefits particularly when dicing low-k-materials. First, the material, which is difficult to be processed by dicing blade, is removed by laser grooving. Laser grooving is followed by step cut or single cut by blade dicing. Chipping or delamination of the low-k layers is reduced to a minimum.
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